ic

2309NZ-1HPGGI8

Symbol
BUF_IN1OUTPUT12OUTPUT23VDD4GND5OUTPUT36OUTPUT47VDD8OUTPUT916OUTPUT815OUTPUT714VDD13GND12OUTPUT611OUTPUT510GND9
Footprint
12345678161514131211109
3D Model
Pin Map
PinNameTypeMountShapeWidth × Height (mm)
BUF_INinputSMDoval0.343×1.731
OUTPUT1outputSMDoval0.343×1.731
OUTPUT2ioSMDoval0.343×1.731
VDDpowerSMDoval0.343×1.731
GNDgroundSMDoval0.343×1.731
OUTPUT3passiveSMDoval0.343×1.731
OUTPUT4passiveSMDoval0.343×1.731
VDDpowerSMDoval0.343×1.731
GNDgroundSMDoval0.343×1.731
OUTPUT5passiveSMDoval0.343×1.731
OUTPUT6passiveSMDoval0.343×1.731
GNDgroundSMDoval0.343×1.731
VDDpowerSMDoval0.343×1.731
OUTPUT7passiveSMDoval0.343×1.731
OUTPUT8passiveSMDoval0.343×1.731
OUTPUT9passiveSMDoval0.343×1.731

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Details

Category
ic
MPN
2309NZ-1HPGGI8
Manufacturer
Renesas Electronics
Package
TSSOP-16
Footprint
TSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL
JLCPCB
C6401514
LCSC
C6401514
Lifecycle
active
Mounting
SMT
RoHS
Compliant
MSL
MSL 1
ECCN
EAR99

JLCPCB Stock & Pricing

Out of Stock(0 pcs)
1-9 pcs$8.0289
10-11 pcs$8.0289
12-199 pcs$8.0289
200-499 pcs$3.2032
500-999 pcs$3.0972
1000+ pcs$3.0442