ic
2EDS8265HXUMA3
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| INA | input | SMD | oval | 0.574×2.401 | |
| INB | output | SMD | oval | 0.574×2.401 | |
| VDDI | io | SMD | oval | 0.574×2.401 | |
| GNDI | passive | SMD | oval | 0.574×2.401 | |
| DISABLE | passive | SMD | oval | 0.574×2.401 | |
| N.C. | passive | SMD | oval | 0.574×2.401 | |
| N.C. | passive | SMD | oval | 0.574×2.401 | |
| SLDON | passive | SMD | oval | 0.574×2.401 | |
| GNDB | passive | SMD | oval | 0.574×2.401 | |
| OUTB | passive | SMD | oval | 0.574×2.401 | |
| VDDB | passive | SMD | oval | 0.574×2.401 | |
| N.C. | passive | SMD | oval | 0.574×2.401 | |
| N.C. | passive | SMD | oval | 0.574×2.401 | |
| GNDA | passive | SMD | oval | 0.574×2.401 | |
| OUTA | passive | SMD | oval | 0.574×2.401 | |
| VDDA | power | SMD | oval | 0.574×2.401 |
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Details
- Category
- ic
- MPN
- 2EDS8265HXUMA3
- Manufacturer
- Infineon Technologies
- Package
- SOIC-16-300mil
- Footprint
- SOIC-16_L10.3-W7.5-P1.27-LS10.3-BL
- JLCPCB
- C7175175
- LCSC
- C7175175
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$5.5856
10-11 pcs$5.5856
12-199 pcs$5.5856
200-499 pcs$2.2298
500-1499 pcs$2.1543
1500+ pcs$2.1173