ic
ACPL-H312-560E
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| A | input | SMD | roundrect | 0.711×2.925 | |
| C | output | SMD | roundrect | 0.711×2.925 | |
| C | io | SMD | roundrect | 0.711×2.925 | |
| N/C | passive | SMD | roundrect | 0.711×2.925 | |
| VEE | passive | SMD | roundrect | 0.711×2.925 | |
| VEE | passive | SMD | roundrect | 0.711×2.925 | |
| VO | passive | SMD | roundrect | 0.711×2.925 | |
| VCC | power | SMD | roundrect | 0.711×2.925 |
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Details
- Category
- ic
- MPN
- ACPL-H312-560E
- Manufacturer
- Broadcom Limited
- Package
- SOIC-8-6.8mm
- Footprint
- SMD-8_L6.8-W5.9-P1.27-LS9.7-BL
- JLCPCB
- C17227174
- LCSC
- C17227174
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$5.6659
10-11 pcs$5.6659
12-199 pcs$5.6659
200-499 pcs$2.2619
500-999 pcs$2.1864
1000+ pcs$2.1478