ic
ADCMP582BCP-R2
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VTP | input | SMD | oval | 0.8×0.28 | |
| VP | output | SMD | oval | 0.8×0.28 | |
| VN | io | SMD | oval | 0.8×0.28 | |
| VTN | passive | SMD | oval | 0.8×0.28 | |
| VCCI | passive | SMD | oval | 0.28×0.8 | |
| LE# | passive | SMD | oval | 0.28×0.8 | |
| LE | passive | SMD | oval | 0.28×0.8 | |
| VTT | passive | SMD | oval | 0.28×0.8 | |
| VCCO | passive | SMD | oval | 0.8×0.28 | |
| Q# | passive | SMD | oval | 0.8×0.28 | |
| Q | passive | SMD | oval | 0.8×0.28 | |
| VCCO | passive | SMD | oval | 0.8×0.28 | |
| VEE | passive | SMD | oval | 0.28×0.8 | |
| HYS | passive | SMD | oval | 0.28×0.8 | |
| GND | ground | SMD | oval | 0.28×0.8 | |
| VCCI | passive | SMD | oval | 0.28×0.8 | |
| EPAD | passive | SMD | roundrect | 1.45×1.45 |
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Details
- Category
- ic
- MPN
- ADCMP582BCP-R2
- Manufacturer
- Analog Devices
- Package
- LFCSP-16(3x3)
- Footprint
- VQFN-16_L3.0-W3.0-P0.50-BL-EP1.4
- JLCPCB
- C3658943
- LCSC
- C3658943
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$19.1373
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250-499 pcs$7.4056
500-999 pcs$7.1454
1000+ pcs$7.0169