ic
ADL5561ACPZ-R7
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VIP2 | input | SMD | roundrect | 0.3×0.8 | |
| VIP1 | output | SMD | roundrect | 0.3×0.8 | |
| VIN1 | input | SMD | roundrect | 0.3×0.8 | |
| VIN2 | input | SMD | roundrect | 0.3×0.8 | |
| VCC | power | SMD | roundrect | 0.8×0.3 | |
| VCC | power | SMD | roundrect | 0.8×0.3 | |
| VCC | power | SMD | roundrect | 0.8×0.3 | |
| VCC | power | SMD | roundrect | 0.8×0.3 | |
| VCOM | passive | SMD | roundrect | 0.3×0.8 | |
| VON | passive | SMD | roundrect | 0.3×0.8 | |
| VOP | passive | SMD | roundrect | 0.3×0.8 | |
| ENBL | passive | SMD | roundrect | 0.3×0.8 | |
| GND | ground | SMD | roundrect | 0.8×0.3 | |
| GND | ground | SMD | roundrect | 0.8×0.3 | |
| GND | ground | SMD | roundrect | 0.8×0.3 | |
| GND | ground | SMD | roundrect | 0.8×0.3 | |
| EP | passive | SMD | roundrect | 1.6×1.6 |
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Details
- Category
- ic
- MPN
- ADL5561ACPZ-R7
- Manufacturer
- Analog Devices
- Package
- LFCSP-16(3x3)
- Footprint
- LFCSP-16_L3.0-W3.0-P0.50-TL-EP1.6-1
- JLCPCB
- C657770
- LCSC
- C657770
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$16.0321
10-11 pcs$15.5887
12-13 pcs$15.5887
14-15 pcs$15.5887
16-17 pcs$15.5887
18+ pcs$15.5887