ic
BD2320EFJ-LAE2
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VCC | power | SMD | oval | 0.63×1.865 | |
| VB | output | SMD | oval | 0.63×1.865 | |
| HO | io | SMD | oval | 0.63×1.865 | |
| VS | passive | SMD | oval | 0.63×1.865 | |
| HIN | passive | SMD | oval | 0.63×1.865 | |
| LIN | passive | SMD | oval | 0.63×1.865 | |
| GND | ground | SMD | oval | 0.63×1.865 | |
| LO | passive | SMD | oval | 0.63×1.865 | |
| EP | passive | SMD | roundrect | 3.3×2.4 |
Save parts to a list and design PCBs from them
Details
- Category
- ic
- MPN
- BD2320EFJ-LAE2
- Manufacturer
- ROHM Semicon
- Package
- HTSOP-8-J
- Footprint
- ESOP-8_L4.9-W3.9-P1.27-LS6.0-BL-EP-1
- JLCPCB
- C6751800
- LCSC
- C6751800
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$1.2627
10-11 pcs$1.2627
12-199 pcs$1.2627
200-499 pcs$0.5045
500-999 pcs$0.4884
1000+ pcs$0.4788