ic

BD6762FV-E2

Symbol

Footprint

3D Model

Pin Map

Pin	Name	Type	Mount	Shape	Width × Height (mm)
	GND	ground	SMD	roundrect	0.336×1.3
	RF	output	SMD	roundrect	0.336×1.3
	UHG	io	SMD	roundrect	0.336×1.3
	U	passive	SMD	roundrect	0.336×1.3
	ULG	passive	SMD	roundrect	0.336×1.3
	VHG	passive	SMD	roundrect	0.336×1.3
	V	passive	SMD	roundrect	0.336×1.3
	VLG	passive	SMD	roundrect	0.336×1.3
	WHG	passive	SMD	roundrect	0.336×1.3
	W	passive	SMD	roundrect	0.336×1.3
	WLG	passive	SMD	roundrect	0.336×1.3
	VREG	passive	SMD	roundrect	0.336×1.3
	CFE	passive	SMD	roundrect	0.336×1.3
	RFE	passive	SMD	roundrect	0.336×1.3
	HU+	passive	SMD	roundrect	0.336×1.3
	HU-	passive	SMD	roundrect	0.336×1.3
	HV+	passive	SMD	roundrect	0.336×1.3
	HV-	passive	SMD	roundrect	0.336×1.3
	HW+	passive	SMD	roundrect	0.336×1.3
	HW-	passive	SMD	roundrect	0.336×1.3
	ST/SP	passive	SMD	roundrect	0.336×1.3
	FR	passive	SMD	roundrect	0.336×1.3
	SB	passive	SMD	roundrect	0.336×1.3
	120/SL	passive	SMD	roundrect	0.336×1.3
	FGIN+	passive	SMD	roundrect	0.336×1.3
	FGIN-	passive	SMD	roundrect	0.336×1.3
	FGOUT	passive	SMD	roundrect	0.336×1.3
	FGSOUT	passive	SMD	roundrect	0.336×1.3
	CLKIN	passive	SMD	roundrect	0.336×1.3
	LPF	passive	SMD	roundrect	0.336×1.3
	POUT	passive	SMD	roundrect	0.336×1.3
	DOUT	output	SMD	roundrect	0.336×1.3
	INTIN	passive	SMD	roundrect	0.336×1.3
	INTOUT	passive	SMD	roundrect	0.336×1.3
	LP	passive	SMD	roundrect	0.336×1.3
	LD	passive	SMD	roundrect	0.336×1.3
	VCC	power	SMD	roundrect	0.336×1.3
	VG	passive	SMD	roundrect	0.336×1.3
	CP2	passive	SMD	roundrect	0.336×1.3
	CP1	passive	SMD	roundrect	0.336×1.3

Save parts to a list and design PCBs from them

Details

Category: ic

MPN: BD6762FV-E2

Manufacturer: ROHM Semicon

Package: SSOPB-40-5.4mm

Footprint: SSOPB-40_L13.6-W5.4-P0.65-LS7.8-BL

JLCPCB: C2150757

LCSC: C2150757

Lifecycle: active

Mounting: SMT

RoHS: Compliant

MSL: MSL 1

ECCN: EAR99

JLCPCB Stock & Pricing

Out of Stock(0 pcs)

1-9 pcs$3.3269

10-11 pcs$3.3269

12-199 pcs$3.3269

200-499 pcs$1.2884

500-999 pcs$1.2418

1000+ pcs$1.2209