ic
BGA 758L7 E6327
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| PON | input | SMD | roundrect | 0.269×0.269 | |
| IN | output | SMD | roundrect | 0.269×0.269 | |
| BIAS | io | SMD | roundrect | 0.269×0.269 | |
| n.c. | passive | SMD | roundrect | 0.269×0.269 | |
| VCC | power | SMD | roundrect | 0.269×0.269 | |
| OUT | output | SMD | roundrect | 0.269×0.269 | |
| GND | ground | SMD | roundrect | 0.5×1.16 |
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Details
- Category
- ic
- MPN
- BGA 758L7 E6327
- Manufacturer
- Infineon Technologies
- Package
- XFDFN-6-EP
- Footprint
- DFN-6_L1.4-W1.3-P0.48-TL-EP
- JLCPCB
- C6131548
- LCSC
- C6131548
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$1.8105
10-11 pcs$1.8105
12-199 pcs$1.8105
200-499 pcs$0.7229
500-999 pcs$0.6988
1000+ pcs$0.6860