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BGA 855N6 E6327

Symbol

Footprint

3D Model

Pin Map

Pin	Name	Type	Mount	Shape	Width × Height (mm)
	GND	ground	SMD	roundrect	0.2×0.2
	VCC	power	SMD	roundrect	0.2×0.2
	AO	io	SMD	roundrect	0.2×0.2
	GND	ground	SMD	roundrect	0.2×0.2
	AI	passive	SMD	roundrect	0.2×0.2
	PON	passive	SMD	roundrect	0.2×0.2

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Details

Category: ic

MPN: BGA 855N6 E6327

Manufacturer: Infineon Technologies

Package: TSNP-6

Footprint: TSNP-6_L1.1-W0.7-P0.40-BL

JLCPCB: C534178

LCSC: C534178

Lifecycle: active

Mounting: SMT

RoHS: Compliant

MSL: MSL 1

ECCN: -

JLCPCB Stock & Pricing

In Stock(17 pcs)

1-9 pcs$1.0715

10-29 pcs$0.8739

30-99 pcs$0.7743

100-499 pcs$0.6764

500-999 pcs$0.6185

1000+ pcs$0.5880