ic
BGA2802,115
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VCC | power | SMD | roundrect | 0.399×0.551 | |
| GND2 | output | SMD | roundrect | 0.399×0.551 | |
| RF_OUT | io | SMD | roundrect | 0.399×0.551 | |
| GND1 | passive | SMD | roundrect | 0.399×0.551 | |
| GND2 | passive | SMD | roundrect | 0.399×0.551 | |
| RF_IN | passive | SMD | roundrect | 0.399×0.551 |
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Details
- Category
- ic
- MPN
- BGA2802,115
- Manufacturer
- NXP Semicon
- Package
- TSSOP-6-1.3mm
- Footprint
- TSSOP-6_L2.0-W1.3-P0.65-LS2.0-BL
- JLCPCB
- C2654210
- LCSC
- C2654210
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$0.3760
10-29 pcs$0.2892
30-99 pcs$0.2523
100-499 pcs$0.2057
500-999 pcs$0.1848
1000+ pcs$0.1719