ic
BGA2866,115
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VCC | power | SMD | roundrect | 0.35×0.9 | |
| GND2 | output | SMD | roundrect | 0.35×0.9 | |
| RF_OUT | io | SMD | roundrect | 0.35×0.9 | |
| GND1 | passive | SMD | roundrect | 0.35×0.9 | |
| GND2 | passive | SMD | roundrect | 0.35×0.9 | |
| RF_IN | passive | SMD | roundrect | 0.35×0.9 |
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Details
- Category
- ic
- MPN
- BGA2866,115
- Manufacturer
- NXP Semicon
- Package
- SOT-363-6
- Footprint
- SOT-363-6_L2.2-W1.3-P0.65-LS2.1-BL
- JLCPCB
- C2802653
- LCSC
- C2802653
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(4 pcs)
1-49 pcs$0.2381
50-149 pcs$0.1849
150-499 pcs$0.1622
500-2999 pcs$0.1337
3000-5999 pcs$0.1212
6000+ pcs$0.1135