ic
BGA735N16E6327XTSA1
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| n/c | input | SMD | roundrect | 0.25×0.25 | |
| VGS | output | SMD | roundrect | 0.25×0.25 | |
| VCC | power | SMD | roundrect | 0.25×0.25 | |
| RFGNDH | passive | SMD | roundrect | 0.25×0.25 | |
| n/c | passive | SMD | roundrect | 0.25×0.25 | |
| RFINM | passive | SMD | roundrect | 0.25×0.25 | |
| RFINH | passive | SMD | roundrect | 0.25×0.25 | |
| RFGNDM | passive | SMD | roundrect | 0.25×0.25 | |
| n/c | passive | SMD | roundrect | 0.25×0.25 | |
| RFINL | passive | SMD | roundrect | 0.25×0.25 | |
| VEN2 | passive | SMD | roundrect | 0.25×0.25 | |
| VEN1 | passive | SMD | roundrect | 0.25×0.25 | |
| RREF | passive | SMD | roundrect | 0.25×0.25 | |
| RFOUTL | passive | SMD | roundrect | 0.25×0.25 | |
| RFOUTH | passive | SMD | roundrect | 0.25×0.25 | |
| RFOUTM | passive | SMD | roundrect | 0.25×0.25 | |
| GND | ground | SMD | roundrect | 1.4×1.4 |
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Details
- Category
- ic
- MPN
- BGA735N16E6327XTSA1
- Manufacturer
- Infineon Technologies
- Package
- XFQFN-16-EP
- Footprint
- TSNP-16_L2.3-W2.3-P0.50-BL-EP1.4
- JLCPCB
- C19314311
- LCSC
- C19314311
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$2.8113
10-11 pcs$2.8113
12-199 pcs$2.8113
200-499 pcs$1.1229
500-999 pcs$1.0844
1000+ pcs$1.0667