ic
BGA7H1N6E6327XTSA1
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| GND | ground | SMD | roundrect | 0.2×0.2 | |
| VCC | power | SMD | roundrect | 0.2×0.2 | |
| AO | io | SMD | roundrect | 0.2×0.2 | |
| GND | ground | SMD | roundrect | 0.2×0.2 | |
| AI | passive | SMD | roundrect | 0.2×0.2 | |
| PON | passive | SMD | roundrect | 0.2×0.2 |
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Details
- Category
- ic
- MPN
- BGA7H1N6E6327XTSA1
- Manufacturer
- Infineon Technologies
- Package
- TSNP-6
- Footprint
- TSNP-6_L1.1-W0.7-P0.40-BR
- JLCPCB
- C2151386
- LCSC
- C2151386
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- ECCN
- -
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$0.6458
10-29 pcs$0.6458
30-199 pcs$0.6458
200-499 pcs$0.2507
500-999 pcs$0.2410
1000+ pcs$0.2378