ic
BGA7P220E6327XTSA1
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| RFINP | output | SMD | roundrect | 0.28×0.8 | |
| RFINN | io | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| VCC2 | passive | SMD | roundrect | 0.8×0.28 | |
| NC | nc | SMD | roundrect | 0.8×0.28 | |
| NC | nc | SMD | roundrect | 0.8×0.28 | |
| NC | nc | SMD | roundrect | 0.8×0.28 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| RFOUT | passive | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| NC | nc | SMD | roundrect | 0.28×0.8 | |
| VCC1 | passive | SMD | roundrect | 0.8×0.28 | |
| NC | nc | SMD | roundrect | 0.8×0.28 | |
| NC | nc | SMD | roundrect | 0.8×0.28 | |
| EN | input | SMD | roundrect | 0.8×0.28 | |
| EP | passive | SMD | custom | 1.7×1.7 |
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Details
- Category
- ic
- MPN
- BGA7P220E6327XTSA1
- Manufacturer
- Infineon Technologies
- Package
- -
- Footprint
- VQFN-16_L3.0-W3.0-P0.50-BL-EP1.7
- JLCPCB
- C3176474
- LCSC
- C3176474
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- 5A991G
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$7.0586
10-11 pcs$7.0586
12-199 pcs$7.0586
200-499 pcs$2.7326
500-999 pcs$2.6362
1000+ pcs$2.5880