ic
BGA9C1MN9E6327XTSA1
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| AO | passive | SMD | roundrect | 0.2×0.2 | |
| GND | ground | SMD | roundrect | 0.2×0.2 | |
| AI | passive | SMD | roundrect | 0.2×0.2 | |
| USID | passive | SMD | roundrect | 0.2×0.2 | |
| VIO | passive | SMD | roundrect | 0.2×0.2 | |
| SCLK | input | SMD | roundrect | 0.2×0.2 | |
| SDATA | passive | SMD | roundrect | 0.2×0.2 | |
| VDD | power | SMD | roundrect | 0.2×0.2 | |
| GND | ground | SMD | roundrect | 0.2×0.2 |
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Details
- Category
- ic
- MPN
- BGA9C1MN9E6327XTSA1
- Manufacturer
- Infineon Technologies
- Package
- XFLGA-9
- Footprint
- TSNP-9_L1.1-W1.1-P0.40-BL
- JLCPCB
- C3191834
- LCSC
- C3191834
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(20 pcs)
1-9 pcs$2.7293
10-29 pcs$2.3310
30-99 pcs$2.0804
100-499 pcs$1.8249
500-999 pcs$1.7093
1000+ pcs$1.6595