ic
BGA9H1BN6E6327XTSA1
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| GND | ground | SMD | roundrect | 0.42×0.22 | |
| VCC | power | SMD | roundrect | 0.42×0.22 | |
| AO | io | SMD | roundrect | 0.42×0.22 | |
| CTRL2 | passive | SMD | roundrect | 0.42×0.22 | |
| AI | passive | SMD | roundrect | 0.42×0.22 | |
| CTRL1 | passive | SMD | roundrect | 0.42×0.22 |
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Details
- Category
- ic
- MPN
- BGA9H1BN6E6327XTSA1
- Manufacturer
- Infineon Technologies
- Package
- TSNP-6
- Footprint
- DFN-6_L1.1-W0.7-P0.40-BL
- JLCPCB
- C3191825
- LCSC
- C3191825
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$0.7390
10-29 pcs$0.7197
30-99 pcs$0.7069
100-101 pcs$0.6940
102-103 pcs$0.6940
104+ pcs$0.6940