ic
BGAP3D30HE6327XUMA1
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| GND | ground | SMD | roundrect | 0.6×0.25 | |
| GND | ground | SMD | roundrect | 0.6×0.25 | |
| RFINP | io | SMD | roundrect | 0.6×0.25 | |
| RFINN | passive | SMD | roundrect | 0.6×0.25 | |
| GND | ground | SMD | roundrect | 0.6×0.25 | |
| GND | ground | SMD | roundrect | 0.6×0.25 | |
| VCC1 | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| VCC2 | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.6×0.25 | |
| GND | ground | SMD | roundrect | 0.6×0.25 | |
| RFOUT | passive | SMD | roundrect | 0.6×0.25 | |
| GND | ground | SMD | roundrect | 0.6×0.25 | |
| GND | ground | SMD | roundrect | 0.6×0.25 | |
| GND | ground | SMD | roundrect | 0.6×0.25 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| NC | nc | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| VBIAS | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| EN | input | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 2.45×2.45 |
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Details
- Category
- ic
- MPN
- BGAP3D30HE6327XUMA1
- Manufacturer
- Infineon Technologies
- Package
- VQFN-24
- Footprint
- VQFN-24_L4.0-W4.0-P0.50-TL-EP2.5
- JLCPCB
- C44292496
- LCSC
- C44292496
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- ECCN
- -
JLCPCB Stock & Pricing
In Stock(20 pcs)
1-9 pcs$4.7759
10-29 pcs$4.6699
30-99 pcs$4.6008
100-101 pcs$4.5301
102-103 pcs$4.5301
104+ pcs$4.5301