ic
BGB707L7ESDE6327XTSA1
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VCC | power | SMD | roundrect | 0.25×0.25 | |
| VBias | passive | SMD | roundrect | 0.25×0.25 | |
| RFin | passive | SMD | roundrect | 0.25×0.25 | |
| RFout | passive | SMD | roundrect | 0.25×0.25 | |
| Vctrl | passive | SMD | roundrect | 0.25×0.25 | |
| ADJ | passive | SMD | roundrect | 0.25×0.25 | |
| GND | ground | SMD | roundrect | 1.2×1 |
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Details
- Category
- ic
- MPN
- BGB707L7ESDE6327XTSA1
- Manufacturer
- Infineon Technologies
- Package
- XFDFN-6-EP
- Footprint
- TSLP-7_L1.3-W2.0-P0.50-BL
- JLCPCB
- C3199311
- LCSC
- C3199311
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(761 pcs)
1-9 pcs$0.7872
10-29 pcs$0.6266
30-99 pcs$0.5462
100-499 pcs$0.4675
500-999 pcs$0.4193
1000+ pcs$0.3952