ic
BGB717L7ESDE6327
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| GND | ground | SMD | roundrect | 0.28×0.425 | |
| RF-In | output | SMD | roundrect | 0.28×0.425 | |
| Bias-Out | io | SMD | roundrect | 0.28×0.425 | |
| CtrlOn/Off | passive | SMD | roundrect | 0.28×0.425 | |
| RF-Out | passive | SMD | roundrect | 0.28×0.425 | |
| VCC | power | SMD | roundrect | 0.28×0.425 | |
| GND | ground | SMD | roundrect | 1.15×1.1 |
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Details
- Category
- ic
- MPN
- BGB717L7ESDE6327
- Manufacturer
- Infineon Technologies
- Package
- XFDFN-6-EP
- Footprint
- DFN-6_L2.0-W1.3-P0.50-BL-EP
- JLCPCB
- C3191815
- LCSC
- C3191815
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$1.2386
10-11 pcs$1.2386
12-199 pcs$1.2386
200-499 pcs$0.4804
500-999 pcs$0.4627
1000+ pcs$0.4547