ic
BGB741L7ESDE6327XTSA1
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VCC | power | SMD | roundrect | 0.25×0.25 | |
| Bias-Out | output | SMD | roundrect | 0.25×0.25 | |
| RF-In | io | SMD | roundrect | 0.25×0.25 | |
| RF-Out | passive | SMD | roundrect | 0.25×0.25 | |
| On/Off | passive | SMD | roundrect | 0.25×0.25 | |
| ADJ | passive | SMD | roundrect | 0.25×0.25 | |
| GND | ground | SMD | roundrect | 1.2×1 |
Save parts to a list and design PCBs from them
Details
- Category
- ic
- MPN
- BGB741L7ESDE6327XTSA1
- Manufacturer
- Infineon Technologies
- Package
- XFDFN-6-EP
- Footprint
- TSLP-7_L1.3-W2.0-P0.50-BL
- JLCPCB
- C3191817
- LCSC
- C3191817
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(8 pcs)
1-9 pcs$0.9687
10-29 pcs$0.7808
30-99 pcs$0.6876
100-499 pcs$0.5944
500-999 pcs$0.5398
1000-1999 pcs$0.5109
2000-3999 pcs$0.5045
4000+ pcs$0.4996