ic
BGM1013
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VS | input | SMD | roundrect | 0.35×0.9 | |
| GND2 | output | SMD | roundrect | 0.35×0.9 | |
| RF_OUT | io | SMD | roundrect | 0.35×0.9 | |
| GND1 | passive | SMD | roundrect | 0.35×0.9 | |
| GND2 | passive | SMD | roundrect | 0.35×0.9 | |
| RF_IN | passive | SMD | roundrect | 0.35×0.9 |
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Details
- Category
- ic
- MPN
- BGM1013
- Manufacturer
- NXP Semicon
- Package
- SOT-363
- Footprint
- SOT-363-6_L2.0-W1.3-P0.65-LS2.1-BL
- JLCPCB
- C3193182
- LCSC
- C3193182
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- -
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$0.7952
10-29 pcs$0.7952
30-199 pcs$0.7952
200-499 pcs$0.3085
500-999 pcs$0.2972
1000+ pcs$0.2924