ic
BGU6104,147
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VCC | power | SMD | roundrect | 0.25×0.4 | |
| n.c. | output | SMD | roundrect | 0.25×0.4 | |
| RF_IN | io | SMD | roundrect | 0.25×0.4 | |
| RF_OUT | passive | SMD | roundrect | 0.25×0.4 | |
| ENABLE | passive | SMD | roundrect | 0.25×0.4 | |
| CUR_ADJ | passive | SMD | roundrect | 0.25×0.4 | |
| GND | ground | SMD | roundrect | 1.1×1.3 |
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Details
- Category
- ic
- MPN
- BGU6104,147
- Manufacturer
- NXP Semicon
- Package
- DFN-6(1.3x2)
- Footprint
- HXSON-6_L1.3-W2.0-P0.50-TL-EP
- JLCPCB
- C2151380
- LCSC
- C2151380
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(159 pcs)
1-9 pcs$0.7438
10-29 pcs$0.7261
30-99 pcs$0.7133
100-101 pcs$0.7021
102-103 pcs$0.7021
104+ pcs$0.7021