ic
BU21079F-E2
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| SIN3 | passive | SMD | roundrect | 0.56×1.365 | |
| SIN2 | passive | SMD | roundrect | 0.56×1.365 | |
| SIN1 | passive | SMD | roundrect | 0.56×1.365 | |
| SIN0 | passive | SMD | roundrect | 0.56×1.365 | |
| AVDD | power | SMD | roundrect | 0.56×1.365 | |
| DVDD | power | SMD | roundrect | 0.56×1.365 | |
| VDD | power | SMD | roundrect | 0.56×1.365 | |
| VSS | ground | SMD | roundrect | 0.56×1.365 | |
| SCL | passive | SMD | roundrect | 0.56×1.365 | |
| SDA | passive | SMD | roundrect | 0.56×1.365 | |
| INT | passive | SMD | roundrect | 0.56×1.365 | |
| TEST | passive | SMD | roundrect | 0.56×1.365 | |
| SIN7 | passive | SMD | roundrect | 0.56×1.365 | |
| SIN6 | passive | SMD | roundrect | 0.56×1.365 | |
| SIN5 | passive | SMD | roundrect | 0.56×1.365 | |
| SIN4 | passive | SMD | roundrect | 0.56×1.365 |
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Details
- Category
- ic
- MPN
- BU21079F-E2
- Manufacturer
- ROHM Semicon
- Package
- SOIC-16-175mil
- Footprint
- SOP-16_L10.0-W4.4-P1.27-LS6.3-BL
- JLCPCB
- C2653140
- LCSC
- C2653140
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$1.7237
10-11 pcs$1.7237
12-199 pcs$1.7237
200-499 pcs$0.6683
500-999 pcs$0.6442
1000+ pcs$0.6330