ic
BU3087FV-E2
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| XIN | input | SMD | oval | 0.343×1.747 | |
| AVDD1 | output | SMD | oval | 0.343×1.747 | |
| AVSS1 | io | SMD | oval | 0.343×1.747 | |
| VCTRL | passive | SMD | oval | 0.343×1.747 | |
| AVDD2 | passive | SMD | oval | 0.343×1.747 | |
| AVSS2 | passive | SMD | oval | 0.343×1.747 | |
| MODSEL1 | passive | SMD | oval | 0.343×1.747 | |
| MODSEL2 | passive | SMD | oval | 0.343×1.747 | |
| CLK27M | passive | SMD | oval | 0.343×1.747 | |
| TEST | passive | SMD | oval | 0.343×1.747 | |
| SSON | passive | SMD | oval | 0.343×1.747 | |
| VSS | ground | SMD | oval | 0.343×1.747 | |
| VDD | power | SMD | oval | 0.343×1.747 | |
| CLKOUT | passive | SMD | oval | 0.343×1.747 | |
| PDB | passive | SMD | oval | 0.343×1.747 | |
| XOUT | passive | SMD | oval | 0.343×1.747 |
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Details
- Category
- ic
- MPN
- BU3087FV-E2
- Manufacturer
- ROHM Semicon
- Package
- SSOP-16(5x6.4)
- Footprint
- SSOP-16_L5.0-W4.4-P0.65-LS6.4-BL-2
- JLCPCB
- C1535641
- LCSC
- C1535641
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$0.9334
10-11 pcs$0.9334
12-199 pcs$0.9334
200-499 pcs$0.3615
500-999 pcs$0.3486
1000+ pcs$0.3422