ic
DS1315S-5+T&R
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| X1 | passive | SMD | oval | 0.574×2.401 | |
| X2 | passive | SMD | oval | 0.574×2.401 | |
| WE# | passive | SMD | oval | 0.574×2.401 | |
| BAT1 | passive | SMD | oval | 0.574×2.401 | |
| GND | ground | SMD | oval | 0.574×2.401 | |
| D | passive | SMD | oval | 0.574×2.401 | |
| Q | passive | SMD | oval | 0.574×2.401 | |
| GND | ground | SMD | oval | 0.574×2.401 | |
| ROM/RAM# | passive | SMD | oval | 0.574×2.401 | |
| CEO# | passive | SMD | oval | 0.574×2.401 | |
| CEI# | passive | SMD | oval | 0.574×2.401 | |
| OE# | passive | SMD | oval | 0.574×2.401 | |
| RST# | passive | SMD | oval | 0.574×2.401 | |
| BAT2 | passive | SMD | oval | 0.574×2.401 | |
| VCC0 | passive | SMD | oval | 0.574×2.401 | |
| VCC1 | passive | SMD | oval | 0.574×2.401 |
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Details
- Category
- ic
- MPN
- DS1315S-5+T&R
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- SOIC-16-300mil
- Footprint
- SOIC-16_L10.3-W7.5-P1.27-LS10.3-BL
- JLCPCB
- C2669565
- LCSC
- C2669565
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
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