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sensorSMT

ICM-42688-P

TDK InvenSense

-40℃~+85℃ 1.71V~3.6V 16bit 2KB 7.5uA IMU (accelerometer + gyroscope) SPI、I2C X,Y,Z X,Y,Z ±16g ±2000dps 运动事件检测、同步与时间戳 LGA-14(2.5x3) Accelerometers ROHS

Symbol
AP_SDO/AP_AD01RESV3RESV7RESV10AP_CS12AP_SDA/AP_SDIO/AP_SDI14RESV2INT1/INT4INT2/FSYNC/CLKIN9RESV11AP_SCL/AP_SCLK13VDDIO5VDD8GND6
Footprint
Pad 1 — smd roundrect 0.675x0.28mm1Pad 2 — smd roundrect 0.675x0.28mm2Pad 3 — smd roundrect 0.675x0.28mm3Pad 4 — smd roundrect 0.675x0.28mm4Pad 5 — smd roundrect 0.28x0.675mm5Pad 6 — smd roundrect 0.28x0.675mm6Pad 7 — smd roundrect 0.28x0.675mm7Pad 8 — smd roundrect 0.675x0.28mm8Pad 9 — smd roundrect 0.675x0.28mm9Pad 10 — smd roundrect 0.675x0.28mm10Pad 11 — smd roundrect 0.675x0.28mm11Pad 12 — smd roundrect 0.28x0.675mm12Pad 13 — smd roundrect 0.28x0.675mm13Pad 14 — smd roundrect 0.28x0.675mm14
3D Model
.glb.step
Pin Map
PadNameTypeMountShapeW×H
1AP_SDO/AP_AD0inputSMDroundrect0.675×0.28
2RESVoutputSMDroundrect0.675×0.28
3RESVioSMDroundrect0.675×0.28
4INT1/INTpassiveSMDroundrect0.675×0.28
5VDDIOpowerSMDroundrect0.28×0.675
6GNDgroundSMDroundrect0.28×0.675
7RESVpassiveSMDroundrect0.28×0.675
8VDDpowerSMDroundrect0.675×0.28
9INT2/FSYNC/CLKINpassiveSMDroundrect0.675×0.28
10RESVpassiveSMDroundrect0.675×0.28
11RESVpassiveSMDroundrect0.675×0.28
12AP_CSpassiveSMDroundrect0.28×0.675
13AP_SCL/AP_SCLKpassiveSMDroundrect0.28×0.675
14AP_SDA/AP_SDIO/AP_SDIpassiveSMDroundrect0.28×0.675

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Details

MPNICM-42688-P
ManufacturerTDK InvenSense
PackageLGA-14(2.5x3)
FootprintLGA-14_L3.0-W2.5-P0.50-TL
LCSCC1850418
Lifecycleactive
MountingSMT
RoHSCompliant
MSLMSL 1
ECCN7A994

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