ic
MAX13042EETD+T
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| I/O VL1 | input | SMD | roundrect | 0.224×0.505 | |
| EN | input | SMD | roundrect | 0.224×0.505 | |
| I/O VL2 | io | SMD | roundrect | 0.224×0.505 | |
| N.C. | passive | SMD | roundrect | 0.224×0.505 | |
| I/O VL3 | passive | SMD | roundrect | 0.224×0.505 | |
| VL | passive | SMD | roundrect | 0.224×0.505 | |
| I/O VL4 | passive | SMD | roundrect | 0.224×0.505 | |
| I/O VCC4 | passive | SMD | roundrect | 0.224×0.505 | |
| VCC | power | SMD | roundrect | 0.224×0.505 | |
| I/O VCC3 | passive | SMD | roundrect | 0.224×0.505 | |
| N.C. | passive | SMD | roundrect | 0.224×0.505 | |
| I/O VCC2 | passive | SMD | roundrect | 0.224×0.505 | |
| GND | ground | SMD | roundrect | 0.224×0.505 | |
| I/O VCC1 | passive | SMD | roundrect | 0.224×0.505 | |
| EP | passive | SMD | roundrect | 2.3×1.7 |
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Details
- Category
- ic
- MPN
- MAX13042EETD+T
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- TDFN-14(3x3)
- Footprint
- TDFN-14_L3.0-W3.0-P0.40-BL-EP
- JLCPCB
- C4364206
- LCSC
- C4364206
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$18.5686
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200-499 pcs$7.1855
500-999 pcs$6.9333
1000+ pcs$6.8096