ic
MAX14657ETE+
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| SDA | input | SMD | roundrect | 0.25×0.6 | |
| VCC | power | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| SAS | passive | SMD | roundrect | 0.25×0.6 | |
| INT# | passive | SMD | roundrect | 0.25×0.6 | |
| DPB | passive | SMD | roundrect | 0.25×0.6 | |
| DMB | passive | SMD | roundrect | 0.25×0.6 | |
| CENB | passive | SMD | roundrect | 0.25×0.6 | |
| TDPB | passive | SMD | roundrect | 0.25×0.6 | |
| TDMB | passive | SMD | roundrect | 0.25×0.6 | |
| TDMA | passive | SMD | roundrect | 0.25×0.6 | |
| TDPA | passive | SMD | roundrect | 0.25×0.6 | |
| CENA | passive | SMD | roundrect | 0.25×0.6 | |
| DMA | passive | SMD | roundrect | 0.25×0.6 | |
| DPA | passive | SMD | roundrect | 0.25×0.6 | |
| SCL | passive | SMD | roundrect | 0.25×0.6 | |
| EP | passive | SMD | roundrect | 1.1×1.1 |
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Details
- Category
- ic
- MPN
- MAX14657ETE+
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- TQFN-16-EP(3x3)
- Footprint
- TQFN-16_L3.0-W3.0-P0.50-BL-EP1.1
- JLCPCB
- C3682651
- LCSC
- C3682651
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$2.7245
10-29 pcs$2.7245
30-199 pcs$2.7245
200-499 pcs$1.0555
500-999 pcs$1.0185
1000+ pcs$0.9992