module
MAX2055EUP+D
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VCC | power | SMD | oval | 0.308×1.706 | |
| RF_IN | output | SMD | oval | 0.308×1.706 | |
| GND | ground | SMD | oval | 0.308×1.706 | |
| B4 | passive | SMD | oval | 0.308×1.706 | |
| B3 | passive | SMD | oval | 0.308×1.706 | |
| B2 | passive | SMD | oval | 0.308×1.706 | |
| B1 | passive | SMD | oval | 0.308×1.706 | |
| B0 | passive | SMD | oval | 0.308×1.706 | |
| VCC | power | SMD | oval | 0.308×1.706 | |
| RF_OUT- | passive | SMD | oval | 0.308×1.706 | |
| RF_OUT+ | passive | SMD | oval | 0.308×1.706 | |
| IBIAS | passive | SMD | oval | 0.308×1.706 | |
| CBP | passive | SMD | oval | 0.308×1.706 | |
| LE | passive | SMD | oval | 0.308×1.706 | |
| AMPIN | passive | SMD | oval | 0.308×1.706 | |
| CC | passive | SMD | oval | 0.308×1.706 | |
| ISET | passive | SMD | oval | 0.308×1.706 | |
| GND | ground | SMD | oval | 0.308×1.706 | |
| ATTNOUT | passive | SMD | oval | 0.308×1.706 | |
| GND | ground | SMD | oval | 0.308×1.706 | |
| EP | passive | SMD | roundrect | 4.3×3.1 |
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Details
- Category
- module
- MPN
- MAX2055EUP+D
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- TSSOP-20
- Footprint
- TSSOP-20_L6.5-W4.4-P0.65-LS6.4-BL-EP-2
- JLCPCB
- C7454657
- LCSC
- C7454657
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
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