ic
MAX22664CAWE+
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VDDA | power | SMD | oval | 0.574×2.401 | |
| IN1 | output | SMD | oval | 0.574×2.401 | |
| IN2 | io | SMD | oval | 0.574×2.401 | |
| IN3 | passive | SMD | oval | 0.574×2.401 | |
| IN4 | passive | SMD | oval | 0.574×2.401 | |
| OUT5 | passive | SMD | oval | 0.574×2.401 | |
| OUT6 | passive | SMD | oval | 0.574×2.401 | |
| GNDA | passive | SMD | oval | 0.574×2.401 | |
| GNDB | passive | SMD | oval | 0.574×2.401 | |
| IN6 | passive | SMD | oval | 0.574×2.401 | |
| IN5 | passive | SMD | oval | 0.574×2.401 | |
| OUT4 | passive | SMD | oval | 0.574×2.401 | |
| OUT3 | passive | SMD | oval | 0.574×2.401 | |
| OUT2 | passive | SMD | oval | 0.574×2.401 | |
| OUT1 | passive | SMD | oval | 0.574×2.401 | |
| VDDB | passive | SMD | oval | 0.574×2.401 |
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Details
- Category
- ic
- MPN
- MAX22664CAWE+
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- SOIC-16-300mil
- Footprint
- SOIC-16_L10.3-W7.5-P1.27-LS10.3-BL
- JLCPCB
- C20265522
- LCSC
- C20265522
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(7 pcs)
1-9 pcs$18.6184
10-45 pcs$17.7573
46-91 pcs$16.2634
92-93 pcs$14.9606
94-95 pcs$14.9606
96+ pcs$14.9606