ic
MAX234EWE+
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| T1OUT | input | SMD | oval | 0.574×2.401 | |
| T2OUT | output | SMD | oval | 0.574×2.401 | |
| T2IN | io | SMD | oval | 0.574×2.401 | |
| T1IN | passive | SMD | oval | 0.574×2.401 | |
| GND | ground | SMD | oval | 0.574×2.401 | |
| VCC | power | SMD | oval | 0.574×2.401 | |
| C1+ | passive | SMD | oval | 0.574×2.401 | |
| V+ | power | SMD | oval | 0.574×2.401 | |
| C1- | passive | SMD | oval | 0.574×2.401 | |
| C2+ | passive | SMD | oval | 0.574×2.401 | |
| C2- | passive | SMD | oval | 0.574×2.401 | |
| V- | passive | SMD | oval | 0.574×2.401 | |
| T3IN | passive | SMD | oval | 0.574×2.401 | |
| T4IN | passive | SMD | oval | 0.574×2.401 | |
| T4OUT | passive | SMD | oval | 0.574×2.401 | |
| T3OUT | passive | SMD | oval | 0.574×2.401 |
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Details
- Category
- ic
- MPN
- MAX234EWE+
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- SOIC-16-300mil
- Footprint
- SOIC-16_L10.3-W7.5-P1.27-LS10.3-BL
- JLCPCB
- C7451796
- LCSC
- C7451796
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
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