ic
MAX25610BAUE+
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| AGND | ground | SMD | oval | 1.747×0.343 | |
| VCC | power | SMD | oval | 1.747×0.343 | |
| PGND | ground | SMD | oval | 1.747×0.343 | |
| INP | passive | SMD | oval | 1.747×0.343 | |
| LX | output | SMD | oval | 1.747×0.343 | |
| LX | output | SMD | oval | 1.747×0.343 | |
| BST | output | SMD | oval | 1.747×0.343 | |
| FLT# | passive | SMD | oval | 1.747×0.343 | |
| VEE | passive | SMD | oval | 1.747×0.343 | |
| INN | passive | SMD | oval | 1.747×0.343 | |
| PWMDIM | passive | SMD | oval | 1.747×0.343 | |
| PWMFRQ | passive | SMD | oval | 1.747×0.343 | |
| COMP | passive | SMD | oval | 1.747×0.343 | |
| OUT | output | SMD | oval | 1.747×0.343 | |
| FB | input | SMD | oval | 1.747×0.343 | |
| REFI | passive | SMD | oval | 1.747×0.343 | |
| EP | passive | SMD | roundrect | 3×3 |
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Details
- Category
- ic
- MPN
- MAX25610BAUE+
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- TSSOP-16-EP
- Footprint
- HTSSOP-16_L5.0-W4.4-P0.65-LS6.4-BL-EP3.0
- JLCPCB
- C3194434
- LCSC
- C3194434
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$13.1116
10-29 pcs$13.1116
30-199 pcs$13.1116
200-499 pcs$5.0747
500-999 pcs$4.8964
1000+ pcs$4.8080