ic
MAX25612BAUP/V+
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| SENSE- | input | SMD | oval | 0.308×1.706 | |
| DIMOUT# | output | SMD | oval | 0.308×1.706 | |
| UVEN | io | SMD | oval | 0.308×1.706 | |
| PWMDIM | passive | SMD | oval | 0.308×1.706 | |
| FLT# | passive | SMD | oval | 0.308×1.706 | |
| RT | passive | SMD | oval | 0.308×1.706 | |
| OVP | passive | SMD | oval | 0.308×1.706 | |
| ICTRL | passive | SMD | oval | 0.308×1.706 | |
| SGND | ground | SMD | oval | 0.308×1.706 | |
| COMP | passive | SMD | oval | 0.308×1.706 | |
| CSN | passive | SMD | oval | 0.308×1.706 | |
| CSP | passive | SMD | oval | 0.308×1.706 | |
| PGND | ground | SMD | oval | 0.308×1.706 | |
| DL | passive | SMD | oval | 0.308×1.706 | |
| VCC | power | SMD | oval | 0.308×1.706 | |
| LX | output | SMD | oval | 0.308×1.706 | |
| DH | passive | SMD | oval | 0.308×1.706 | |
| BST | output | SMD | oval | 0.308×1.706 | |
| IN | passive | SMD | oval | 0.308×1.706 | |
| ISENSE+ | passive | SMD | oval | 0.308×1.706 | |
| EP | passive | SMD | roundrect | 5.2×3 |
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Details
- Category
- ic
- MPN
- MAX25612BAUP/V+
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- TSSOP-20-EP
- Footprint
- TSSOP-20_L6.5-W4.4-P0.65-LS6.4-BL-EP
- JLCPCB
- C20265549
- LCSC
- C20265549
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
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