ic
MAX3736ETE+
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VCC | power | SMD | roundrect | 0.25×0.6 | |
| IN+ | output | SMD | roundrect | 0.25×0.6 | |
| IN | io | SMD | roundrect | 0.25×0.6 | |
| VCC | power | SMD | roundrect | 0.25×0.6 | |
| BIASSET | passive | SMD | roundrect | 0.25×0.6 | |
| MODSET | passive | SMD | roundrect | 0.25×0.6 | |
| BC_MON | passive | SMD | roundrect | 0.25×0.6 | |
| BIAS | passive | SMD | roundrect | 0.25×0.6 | |
| VCC | power | SMD | roundrect | 0.25×0.6 | |
| OUT+ | passive | SMD | roundrect | 0.25×0.6 | |
| OUT | output | SMD | roundrect | 0.25×0.6 | |
| VCC | power | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| VCC | power | SMD | roundrect | 0.25×0.6 | |
| DIS | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 1.5×1.5 |
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Details
- Category
- ic
- MPN
- MAX3736ETE+
- Manufacturer
- Analog Devices Inc./Maxim Integrated
- Package
- TQFN-16-EP(3x3)
- Footprint
- TQFN-16_L3.0-W3.0-P0.50-BL-EP1.5
- JLCPCB
- C1519151
- LCSC
- C1519151
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$3.9566
10-29 pcs$3.1663
30-99 pcs$2.8338
100-499 pcs$2.4964
500-999 pcs$2.3422
1000+ pcs$2.2715