ic
MC33887APVW
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| AGND | ground | SMD | roundrect | 0.7×1.8 | |
| FS# | output | SMD | roundrect | 0.7×1.8 | |
| IN1 | io | SMD | roundrect | 0.7×1.8 | |
| V+ | power | SMD | roundrect | 0.7×1.8 | |
| V+ | power | SMD | roundrect | 0.7×1.8 | |
| OUT1 | passive | SMD | roundrect | 0.7×1.8 | |
| OUT1 | passive | SMD | roundrect | 0.7×1.8 | |
| FB | input | SMD | roundrect | 0.7×1.8 | |
| PGND | ground | SMD | roundrect | 0.7×1.8 | |
| PGND | ground | SMD | roundrect | 0.7×1.8 | |
| PGND | ground | SMD | roundrect | 0.7×1.8 | |
| PGND | ground | SMD | roundrect | 0.7×1.8 | |
| D2# | passive | SMD | roundrect | 0.7×1.8 | |
| OUT2 | passive | SMD | roundrect | 0.7×1.8 | |
| OUT2 | passive | SMD | roundrect | 0.7×1.8 | |
| V+ | power | SMD | roundrect | 0.7×1.8 | |
| CCP | passive | SMD | roundrect | 0.7×1.8 | |
| D1 | passive | SMD | roundrect | 0.7×1.8 | |
| IN2 | passive | SMD | roundrect | 0.7×1.8 | |
| EN | input | SMD | roundrect | 0.7×1.8 | |
| EP | passive | SMD | custom | 16.356×6.499 |
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Details
- Category
- ic
- MPN
- MC33887APVW
- Manufacturer
- NXP Semicon
- Package
- HSOP-20-EP-11.0mm
- Footprint
- HSOP-20_L15.9-W11.0-P1.27-TL-EP
- JLCPCB
- C1556894
- LCSC
- C1556894
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$8.9815
10-11 pcs$8.6731
12-13 pcs$8.6731
14-15 pcs$8.6731
16-17 pcs$8.6731
18+ pcs$8.6731