ic
MCP1700T-3002E/MAY
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VIN | input | SMD | roundrect | 0.35×0.5 | |
| NC | nc | SMD | roundrect | 0.35×0.5 | |
| GND | ground | SMD | roundrect | 0.35×0.5 | |
| NC | nc | SMD | roundrect | 0.35×0.5 | |
| NC | nc | SMD | roundrect | 0.35×0.5 | |
| VOUT | output | SMD | roundrect | 0.35×0.5 | |
| EP | passive | SMD | roundrect | 0.96×1.65 |
Save parts to a list and design PCBs from them
Details
- Category
- ic
- MPN
- MCP1700T-3002E/MAY
- Manufacturer
- Microchip Technology
- Package
- TDFN-6-EP(2x2)
- Footprint
- TDFN-6_L2.0-W2.0-P0.65-TL-EP1.7
- JLCPCB
- C625351
- LCSC
- C625351
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(5 pcs)
1-9 pcs$1.0249
10-29 pcs$1.0041
30-99 pcs$0.9912
100-101 pcs$0.9767
102-103 pcs$0.9767
104+ pcs$0.9767