ic
MCP23009T-E/MG
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VSS | ground | SMD | roundrect | 0.25×0.6 | |
| NC | nc | SMD | roundrect | 0.25×0.6 | |
| VDD | power | SMD | roundrect | 0.25×0.6 | |
| SCL | passive | SMD | roundrect | 0.25×0.6 | |
| SDA | passive | SMD | roundrect | 0.25×0.6 | |
| ADDR | passive | SMD | roundrect | 0.25×0.6 | |
| RESET# | passive | SMD | roundrect | 0.25×0.6 | |
| INT | passive | SMD | roundrect | 0.25×0.6 | |
| GP0 | passive | SMD | roundrect | 0.25×0.6 | |
| GP1 | passive | SMD | roundrect | 0.25×0.6 | |
| GP2 | passive | SMD | roundrect | 0.25×0.6 | |
| GP3 | passive | SMD | roundrect | 0.25×0.6 | |
| GP4 | passive | SMD | roundrect | 0.25×0.6 | |
| GP5 | passive | SMD | roundrect | 0.25×0.6 | |
| GP6 | passive | SMD | roundrect | 0.25×0.6 | |
| GP7 | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 1.1×1.1 |
Key Parameters
Frequency
3.4MHz
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Details
- Category
- ic
- MPN
- MCP23009T-E/MG
- Manufacturer
- Microchip Technology
- Package
- TQFN-16-EP(3x3)
- Footprint
- TQFN-16_L3.0-W3.0-P0.50-BL-EP1.1
- JLCPCB
- C623184
- LCSC
- C623184
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(36 pcs)
1-9 pcs$3.1775
10-29 pcs$2.7197
30-99 pcs$2.4466
100-499 pcs$2.1719
500-999 pcs$2.0450
1000+ pcs$1.9872