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MCP23S17-E/ML

Microchip Technology

-40℃~+125℃ 1.8V~5.5V 10MHz 16 1uA 3mA 600mV 8 8mA Interrupt Output Reset function、Cascading and address extension SPI QFN-28-EP(6x6) I/O Expanders ROHS

Symbol
GPB025GPB227GPB41GPB63CS7SCK8A011A213INTB15GPA017GPA219GPA421GPA623Thermal Pad29GPB126GPB328GPB52GPB74SI9SO10A112RESET#14INTA16GPA118GPA320GPA522GPA724VDD5VSS6
Footprint
Pad 1 — smd oval 0.364x0.847mm1Pad 2 — smd oval 0.364x0.847mm2Pad 3 — smd oval 0.364x0.847mm3Pad 4 — smd oval 0.364x0.847mm4Pad 5 — smd oval 0.364x0.847mm5Pad 6 — smd oval 0.364x0.847mm6Pad 7 — smd oval 0.364x0.847mm7Pad 8 — smd oval 0.847x0.364mm8Pad 9 — smd oval 0.847x0.364mm9Pad 10 — smd oval 0.847x0.364mm10Pad 11 — smd oval 0.847x0.364mm11Pad 12 — smd oval 0.847x0.364mm12Pad 13 — smd oval 0.847x0.364mm13Pad 14 — smd oval 0.847x0.364mm14Pad 15 — smd oval 0.364x0.847mm15Pad 16 — smd oval 0.364x0.847mm16Pad 17 — smd oval 0.364x0.847mm17Pad 18 — smd oval 0.364x0.847mm18Pad 19 — smd oval 0.364x0.847mm19Pad 20 — smd oval 0.364x0.847mm20Pad 21 — smd oval 0.364x0.847mm21Pad 22 — smd oval 0.847x0.364mm22Pad 23 — smd oval 0.847x0.364mm23Pad 24 — smd oval 0.847x0.364mm24Pad 25 — smd oval 0.847x0.364mm25Pad 26 — smd oval 0.847x0.364mm26Pad 27 — smd oval 0.847x0.364mm27Pad 28 — smd oval 0.847x0.364mm28Pad 29 — smd roundrect 4.7x4.7mm29
3D Model
.glb.step
Pin Map
PadNameTypeMountShapeW×H
25GPB0passiveSMDoval0.847×0.364
26GPB1passiveSMDoval0.847×0.364
27GPB2passiveSMDoval0.847×0.364
28GPB3passiveSMDoval0.847×0.364
1GPB4inputSMDoval0.364×0.847
2GPB5outputSMDoval0.364×0.847
3GPB6ioSMDoval0.364×0.847
4GPB7passiveSMDoval0.364×0.847
5VDDpowerSMDoval0.364×0.847
6VSSgroundSMDoval0.364×0.847
7CSinputSMDoval0.364×0.847
8SCKinputSMDoval0.847×0.364
9SIpassiveSMDoval0.847×0.364
10SOoutputSMDoval0.847×0.364
11A0passiveSMDoval0.847×0.364
12A1passiveSMDoval0.847×0.364
13A2passiveSMDoval0.847×0.364
14RESET#passiveSMDoval0.847×0.364
15INTBpassiveSMDoval0.364×0.847
16INTApassiveSMDoval0.364×0.847
17GPA0passiveSMDoval0.364×0.847
18GPA1passiveSMDoval0.364×0.847
19GPA2passiveSMDoval0.364×0.847
20GPA3passiveSMDoval0.364×0.847
21GPA4passiveSMDoval0.364×0.847
22GPA5passiveSMDoval0.847×0.364
23GPA6passiveSMDoval0.847×0.364
24GPA7passiveSMDoval0.847×0.364
29Thermal PadpassiveSMDroundrect4.7×4.7

Key Parameters

Frequency
10MHz

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Details

MPNMCP23S17-E/ML
ManufacturerMicrochip Technology
PackageQFN-28-EP(6x6)
FootprintQFN-28_L6.0-W6.0-P0.65-BL-EP
LCSCC147896
Lifecycleactive
MountingSMT
RoHSCompliant
MSLMSL 1
ECCNEAR99

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