ic
MCP6052T-E/MNY
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| NC | nc | SMD | roundrect | 0.28×0.665 | |
| VIN– | output | SMD | roundrect | 0.28×0.665 | |
| VIN+ | io | SMD | roundrect | 0.28×0.665 | |
| VSS | ground | SMD | roundrect | 0.28×0.665 | |
| NC | nc | SMD | roundrect | 0.28×0.665 | |
| VOUT | output | SMD | roundrect | 0.28×0.665 | |
| VDD | power | SMD | roundrect | 0.28×0.665 | |
| NC | nc | SMD | roundrect | 0.28×0.665 | |
| GND | ground | SMD | roundrect | 1.4×1.4 |
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Details
- Category
- ic
- MPN
- MCP6052T-E/MNY
- Manufacturer
- Microchip Technology
- Package
- UFDFN-8-EP(2x3)
- Footprint
- UFDFN-8_L3.0-W2.0-P0.50-TL-EP1.4
- JLCPCB
- C623680
- LCSC
- C623680
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$0.8450
10-29 pcs$0.6828
30-99 pcs$0.6025
100-499 pcs$0.5205
500-999 pcs$0.4723
1000+ pcs$0.4482