ic
MCP6H74-E/SL
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VOUTA | output | SMD | oval | 0.574×2.038 | |
| VINA– | output | SMD | oval | 0.574×2.038 | |
| VINA+ | io | SMD | oval | 0.574×2.038 | |
| VDD | power | SMD | oval | 0.574×2.038 | |
| VINB+ | passive | SMD | oval | 0.574×2.038 | |
| VINB– | passive | SMD | oval | 0.574×2.038 | |
| VOUTB | output | SMD | oval | 0.574×2.038 | |
| VOUTC | output | SMD | oval | 0.574×2.038 | |
| VINC– | passive | SMD | oval | 0.574×2.038 | |
| VINC+ | passive | SMD | oval | 0.574×2.038 | |
| VSS | ground | SMD | oval | 0.574×2.038 | |
| VIND+ | passive | SMD | oval | 0.574×2.038 | |
| VIND– | passive | SMD | oval | 0.574×2.038 | |
| VOUTD | output | SMD | oval | 0.574×2.038 |
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Details
- Category
- ic
- MPN
- MCP6H74-E/SL
- Manufacturer
- Microchip Technology
- Package
- SOIC-14
- Footprint
- SOIC-14_L8.7-W3.9-P1.27-LS6.0-BL
- JLCPCB
- C640929
- LCSC
- C640929
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
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