ic

MCZ33797EKR2

Symbol
SQB_LO_1A1SENSE_1A2MOSI3CLK4SQB_HI_1A5VFIRE_1A6VDIAG_17GND8MISO9VDD10VFIRE_1B11SQB_HI_1B12FEN_113R_LIMIT_114SENSE_1B15SQB_LO_1B16SQB_LO_2A32SENSE_2A31CS#30RST#29SQB_HI_2A28VFIRE_2A27VDIAG_226VFIRE_RTN25VFIRE_RTN24R_DIAG23VFIRE_2B22SQB_HI_2B21FEN_220R_LIMIT_219SENSE_2B18SQB_LO_2B17
Footprint
1234567891011121314151632313029282726252423222120191817
3D Model
Pin Map
PinNameTypeMountShapeWidth × Height (mm)
SQB_LO_1AinputSMDoval0.364×2.002
SENSE_1AoutputSMDoval0.364×2.002
MOSIinputSMDoval0.364×2.002
CLKinputSMDoval0.364×2.002
SQB_HI_1ApassiveSMDoval0.364×2.002
VFIRE_1ApassiveSMDoval0.364×2.002
VDIAG_1passiveSMDoval0.364×2.002
GNDgroundSMDoval0.364×2.002
MISOoutputSMDoval0.364×2.002
VDDpowerSMDoval0.364×2.002
VFIRE_1BpassiveSMDoval0.364×2.002
SQB_HI_1BpassiveSMDoval0.364×2.002
FEN_1passiveSMDoval0.364×2.002
R_LIMIT_1passiveSMDoval0.364×2.002
SENSE_1BpassiveSMDoval0.364×2.002
SQB_LO_1BpassiveSMDoval0.364×2.002
SQB_LO_2BpassiveSMDoval0.364×2.002
SENSE_2BpassiveSMDoval0.364×2.002
R_LIMIT_2passiveSMDoval0.364×2.002
FEN_2passiveSMDoval0.364×2.002
SQB_HI_2BpassiveSMDoval0.364×2.002
VFIRE_2BpassiveSMDoval0.364×2.002
R_DIAGpassiveSMDoval0.364×2.002
VFIRE_RTNpassiveSMDoval0.364×2.002
VFIRE_RTNpassiveSMDoval0.364×2.002
VDIAG_2passiveSMDoval0.364×2.002
VFIRE_2ApassiveSMDoval0.364×2.002
SQB_HI_2ApassiveSMDoval0.364×2.002
RST#passiveSMDoval0.364×2.002
CS#passiveSMDoval0.364×2.002
SENSE_2ApassiveSMDoval0.364×2.002
SQB_LO_2ApassiveSMDoval0.364×2.002

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Details

Category
ic
MPN
MCZ33797EKR2
Manufacturer
NXP Semicon
Package
SOIC-32
Footprint
SOIC-32_L11.2-W7.6-P0.65-LS10.4-BL
JLCPCB
C19843688
LCSC
C19843688
Lifecycle
active
Mounting
SMT
RoHS
Compliant
MSL
MSL 3
ECCN
EAR99

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