ic
MS35778TE
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| BOUT1 | input | SMD | roundrect | 0.35×1.575 | |
| SENB | output | SMD | roundrect | 0.35×1.575 | |
| VM | io | SMD | roundrect | 0.35×1.575 | |
| BOUT2 | passive | SMD | roundrect | 0.35×1.575 | |
| ENN | passive | SMD | roundrect | 0.35×1.575 | |
| GND | ground | SMD | roundrect | 0.35×1.575 | |
| CPO | passive | SMD | roundrect | 0.35×1.575 | |
| CPI | passive | SMD | roundrect | 0.35×1.575 | |
| VCP | passive | SMD | roundrect | 0.35×1.575 | |
| MODE | passive | SMD | roundrect | 0.35×1.575 | |
| V5 | passive | SMD | roundrect | 0.35×1.575 | |
| MS1 | passive | SMD | roundrect | 0.35×1.575 | |
| NC | nc | SMD | roundrect | 0.35×1.575 | |
| MS2 | passive | SMD | roundrect | 0.35×1.575 | |
| FAULT | passive | SMD | roundrect | 0.35×1.575 | |
| FGO | passive | SMD | roundrect | 0.35×1.575 | |
| CLK | input | SMD | roundrect | 0.35×1.575 | |
| PDN | passive | SMD | roundrect | 0.35×1.575 | |
| VIO | passive | SMD | roundrect | 0.35×1.575 | |
| STEP | passive | SMD | roundrect | 0.35×1.575 | |
| VREF | passive | SMD | roundrect | 0.35×1.575 | |
| GND | ground | SMD | roundrect | 0.35×1.575 | |
| DIR | passive | SMD | roundrect | 0.35×1.575 | |
| SLEEP | passive | SMD | roundrect | 0.35×1.575 | |
| AOUT2 | passive | SMD | roundrect | 0.35×1.575 | |
| VM | passive | SMD | roundrect | 0.35×1.575 | |
| SENA | passive | SMD | roundrect | 0.35×1.575 | |
| AOUT1 | passive | SMD | roundrect | 0.35×1.575 | |
| EP | passive | SMD | roundrect | 6×2.35 |
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Details
- Category
- ic
- MPN
- MS35778TE
- Manufacturer
- Hangzhou Ruimeng Tech
- Package
- eTSSOP28
- Footprint
- ETSSOP-28_L9.7-W4.4-P0.65-LS6.4-BL-EP6.0
- JLCPCB
- C49304410
- LCSC
- C49304410
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-99 pcs$0.0391
100+ pcs$0.0201