ic
NEX90230BPA-Q100F
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| IN | input | SMD | roundrect | 1.803×0.406 | |
| EN | input | SMD | roundrect | 1.803×0.406 | |
| NC | nc | SMD | roundrect | 1.803×0.406 | |
| GND | ground | SMD | roundrect | 1.803×0.406 | |
| GND | ground | SMD | roundrect | 1.803×0.406 | |
| GND | ground | SMD | roundrect | 1.803×0.406 | |
| NC/PG | nc | SMD | roundrect | 1.803×0.406 | |
| OUT | output | SMD | roundrect | 1.803×0.406 | |
| EP | passive | SMD | roundrect | 1.88×1.98 |
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Details
- Category
- ic
- MPN
- NEX90230BPA-Q100F
- Manufacturer
- Nexperia
- Package
- HTSSOP-8
- Footprint
- TSSOP-8_L3.0-W3.0-P0.65-LS4.9-BL-EP
- JLCPCB
- C45302053
- LCSC
- C45302053
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- ECCN
- -
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-99 pcs$0.0391
100+ pcs$0.0201