ic
RMPA2456
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VM123 | input | SMD | roundrect | 0.25×0.6 | |
| VC2 | output | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| RF_IN | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| VC1 | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| RFOUT | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| N/C | passive | SMD | roundrect | 0.25×0.6 | |
| VC3 | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| VDET | passive | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| GND | ground | SMD | roundrect | 0.25×0.6 | |
| EP | passive | SMD | roundrect | 1.1×1.1 |
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Details
- Category
- ic
- MPN
- RMPA2456
- Manufacturer
- ON Semiconductor
- Package
- QFN-16(3x3)
- Footprint
- TQFN-16_L3.0-W3.0-P0.50-BL-EP1.1
- JLCPCB
- C17451252
- LCSC
- C17451252
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Non-Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$1.9936
10-29 pcs$1.9936
30-199 pcs$1.9936
200-499 pcs$0.7952
500-999 pcs$0.7695
1000+ pcs$0.7567