ic
SGM61060
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VIN | input | SMD | roundrect | 0.25×0.75 | |
| VIN | input | SMD | roundrect | 0.25×0.75 | |
| GND | ground | SMD | roundrect | 0.25×0.75 | |
| GND | ground | SMD | roundrect | 0.25×0.75 | |
| AGND | ground | SMD | roundrect | 0.75×0.25 | |
| FB | input | SMD | roundrect | 0.75×0.25 | |
| COMP | passive | SMD | roundrect | 0.75×0.25 | |
| RT/CLK | passive | SMD | roundrect | 0.75×0.25 | |
| SS/TR | input | SMD | roundrect | 0.25×0.75 | |
| SW | output | SMD | roundrect | 0.25×0.75 | |
| SW | output | SMD | roundrect | 0.25×0.75 | |
| SW | output | SMD | roundrect | 0.25×0.75 | |
| BOOT | passive | SMD | roundrect | 0.75×0.25 | |
| PG | passive | SMD | roundrect | 0.75×0.25 | |
| EN | input | SMD | roundrect | 0.75×0.25 | |
| VIN | input | SMD | roundrect | 0.75×0.25 | |
| EP | passive | SMD | roundrect | 1.7×1.7 |
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Details
- Category
- ic
- MPN
- SGM61060
- Manufacturer
- JLCPCB Assembly
- Package
- QFN-16-L3.0-W3.0-P0.50-BL-EP1.7
- Footprint
- TQFN-16_L3.0-W3.0-P0.50-BL-EP1.7
- JLCPCB
- C9900099478
- LCSC
- C9900099478
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-99 pcs$0.0391
100+ pcs$0.0201