ic
SY88303BLMG-TR
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| DIN | input | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| /DIN | passive | SMD | roundrect | 0.28×0.8 | |
| VCC | power | SMD | roundrect | 0.28×0.8 | |
| VREF | passive | SMD | roundrect | 0.28×0.8 | |
| LOS | passive | SMD | roundrect | 0.28×0.8 | |
| VCC | power | SMD | roundrect | 0.28×0.8 | |
| /DOUT | passive | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| GND | ground | SMD | roundrect | 0.28×0.8 | |
| DOUT | output | SMD | roundrect | 0.28×0.8 | |
| VCC | power | SMD | roundrect | 0.28×0.8 | |
| LOSLVL | passive | SMD | roundrect | 0.28×0.8 | |
| /EN | passive | SMD | roundrect | 0.28×0.8 | |
| VCC | power | SMD | roundrect | 0.28×0.8 | |
| EP | passive | SMD | roundrect | 1.6×1.6 |
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Details
- Category
- ic
- MPN
- SY88303BLMG-TR
- Manufacturer
- Microchip Technology
- Package
- TQFN-16-EP(3x3)
- Footprint
- TQFN-16_L3.0-W3.0-P0.50-TL-EP1.6
- JLCPCB
- C632425
- LCSC
- C632425
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$2.8756
10-29 pcs$2.4401
30-99 pcs$2.1676
100-499 pcs$1.8886
500-999 pcs$1.7612
1000+ pcs$1.7079