ic
TFF11092HN/N1X
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| VREGVCO | input | SMD | roundrect | 0.28×0.8 | |
| CPOUT | output | SMD | roundrect | 0.28×0.8 | |
| VTUNE | io | SMD | roundrect | 0.28×0.8 | |
| NSL0 | passive | SMD | roundrect | 0.28×0.8 | |
| NSL1 | passive | SMD | roundrect | 0.28×0.8 | |
| NSL2 | passive | SMD | roundrect | 0.28×0.8 | |
| LCKDET | passive | SMD | roundrect | 0.8×0.28 | |
| GND1(REF) | passive | SMD | roundrect | 0.8×0.28 | |
| IN(REF)_P | passive | SMD | roundrect | 0.8×0.28 | |
| IN(REF)_N | passive | SMD | roundrect | 0.8×0.28 | |
| GND2(REF) | passive | SMD | roundrect | 0.8×0.28 | |
| VCC(REF) | power | SMD | roundrect | 0.8×0.28 | |
| VCC(DIV) | power | SMD | roundrect | 0.28×0.8 | |
| GND(DIV) | ground | SMD | roundrect | 0.28×0.8 | |
| n.c. | passive | SMD | roundrect | 0.28×0.8 | |
| n.c. | passive | SMD | roundrect | 0.28×0.8 | |
| GND1(BUF) | passive | SMD | roundrect | 0.28×0.8 | |
| VCC(BUF) | power | SMD | roundrect | 0.28×0.8 | |
| GND2(BUF) | passive | SMD | roundrect | 0.8×0.28 | |
| BUF1_N | passive | SMD | roundrect | 0.8×0.28 | |
| BUF2_N | passive | SMD | roundrect | 0.8×0.28 | |
| BUF1_P | passive | SMD | roundrect | 0.8×0.28 | |
| BUF2_P | passive | SMD | roundrect | 0.8×0.28 | |
| GND3(BUF) | passive | SMD | roundrect | 0.8×0.28 | |
| EP | passive | SMD | roundrect | 2.1×2.1 |
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Details
- Category
- ic
- MPN
- TFF11092HN/N1X
- Manufacturer
- NXP Semicon
- Package
- HVQFN-24-EP(4x4)
- Footprint
- HVQFN-24_L4.0-W4.0-P0.50-BL-EP2.1
- JLCPCB
- C2669222
- LCSC
- C2669222
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$10.3004
10-11 pcs$10.3004
12-199 pcs$10.3004
200-499 pcs$3.9872
500-1499 pcs$3.8458
1500+ pcs$3.7767