ic
THS3062DDAG3
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| 1VOUT | input | SMD | oval | 0.6×1.6 | |
| 1VIN− | output | SMD | oval | 0.6×1.6 | |
| 1VIN+ | io | SMD | oval | 0.6×1.6 | |
| VS− | passive | SMD | oval | 0.6×1.6 | |
| 2VIN+ | passive | SMD | oval | 0.6×1.6 | |
| 2VIN- | passive | SMD | oval | 0.6×1.6 | |
| 2VOUT | passive | SMD | oval | 0.6×1.6 | |
| VS+ | passive | SMD | oval | 0.6×1.6 | |
| EP | passive | SMD | roundrect | 3.2×2.5 |
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Details
- Category
- ic
- MPN
- THS3062DDAG3
- Manufacturer
- Texas Instruments
- Package
- Power-Pad-SO-8
- Footprint
- POWERPAD-SO-8_L4.9-W3.9-P1.27-LS6.0-BL-EP
- JLCPCB
- C1348446
- LCSC
- C1348446
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$15.6385
10-29 pcs$15.6385
30-199 pcs$15.6385
200-499 pcs$6.0530
500-999 pcs$5.8394
1000+ pcs$5.7349