ic
TLE80803EMXUMA1
Symbol
Footprint
3D Model
No 3D preview
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| KIO | input | SMD | oval | 0.356×1.824 | |
| VS | output | SMD | oval | 0.356×1.824 | |
| OUT5 | io | SMD | oval | 0.356×1.824 | |
| OUT4 | passive | SMD | oval | 0.356×1.824 | |
| OUT3 | passive | SMD | oval | 0.356×1.824 | |
| PGND | ground | SMD | oval | 0.356×1.824 | |
| OUT2 | passive | SMD | oval | 0.356×1.824 | |
| OUT1 | passive | SMD | oval | 0.356×1.824 | |
| PGND | ground | SMD | oval | 0.356×1.824 | |
| VR_IN1 | passive | SMD | oval | 0.356×1.824 | |
| VR_IN2 | passive | SMD | oval | 0.356×1.824 | |
| WD_DIS | passive | SMD | oval | 0.356×1.824 | |
| VR_OUT | passive | SMD | oval | 0.356×1.824 | |
| SO | output | SMD | oval | 0.356×1.824 | |
| SI | passive | SMD | oval | 0.356×1.824 | |
| SCLK | input | SMD | oval | 0.356×1.824 | |
| CSN | passive | SMD | oval | 0.356×1.824 | |
| IN1 | passive | SMD | oval | 0.356×1.824 | |
| IN3 | passive | SMD | oval | 0.356×1.824 | |
| NRO | passive | SMD | oval | 0.356×1.824 | |
| V5DD | passive | SMD | oval | 0.356×1.824 | |
| AGND | ground | SMD | oval | 0.356×1.824 | |
| RX | input | SMD | oval | 0.356×1.824 | |
| TX | output | SMD | oval | 0.356×1.824 | |
| PGND | ground | SMD | roundrect | 6.4×2.6 |
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Details
- Category
- ic
- MPN
- TLE80803EMXUMA1
- Manufacturer
- Infineon Technologies
- Package
- SSOP-24-EP-150mil
- Footprint
- SSOP-24_L8.7-W3.9-P0.64-LS6.0-BL-EP
- JLCPCB
- C2156232
- LCSC
- C2156232
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 3
- ECCN
- EAR99
JLCPCB Stock & Pricing
In Stock(1 pcs)
1-9 pcs$6.5542
10-29 pcs$6.4016
30-99 pcs$6.2988
100-101 pcs$6.1976
102-103 pcs$6.1976
104+ pcs$6.1976