ic
TPA0211DGNG4
Symbol
Footprint
3D Model
Pin Map
| Pin | Name | Type | Mount | Shape | Width × Height (mm) |
|---|---|---|---|---|---|
| IN | input | SMD | roundrect | 0.364×1.43 | |
| SHUTDOWN# | output | SMD | roundrect | 0.364×1.43 | |
| VDD | power | SMD | roundrect | 0.364×1.43 | |
| BYPASS | passive | SMD | roundrect | 0.364×1.43 | |
| VO+ | passive | SMD | roundrect | 0.364×1.43 | |
| SE/BTL# | passive | SMD | roundrect | 0.364×1.43 | |
| GND | ground | SMD | roundrect | 0.364×1.43 | |
| VO- | passive | SMD | roundrect | 0.364×1.43 | |
| EP | passive | SMD | roundrect | 1.8×1.5 |
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Details
- Category
- ic
- MPN
- TPA0211DGNG4
- Manufacturer
- Texas Instruments
- Package
- HVSSOP-8
- Footprint
- HVSSOP-8_L3.0-W3.0-P0.65-LS4.9-BL-EP
- JLCPCB
- C4990902
- LCSC
- C4990902
- Lifecycle
- active
- Mounting
- SMT
- RoHS
- Compliant
- MSL
- MSL 1
- ECCN
- EAR99
JLCPCB Stock & Pricing
Out of Stock(0 pcs)
1-9 pcs$5.6916
10-29 pcs$4.8739
30-99 pcs$4.3872
100-499 pcs$3.8956
500-999 pcs$3.6691
1000+ pcs$3.5663